facilities
Facility User Rates
cleanroom floorplan
personnel
Courses
equipment
Back End Processing
Dry Etching
Ebeam Lithography
Materials Characterization
Metalization / Thin Film Deposition
Metrology
Photolithography
Thermal Processing
all equipment
access
UCSD internal users
non-UCSD external users
Safety
Statement
Evacuation Map
Resources
Services
E-Beam Lithography
Dicing
Microfluidics
Login
username:
password:
Remember me on this computer:
Lost username/ password
Equipment
Name:
Xactix XeF2 Etcher
Equipment Type:
Dry Etching
Description:
XeF2 (xenon difluoride) isotropic silicon etcher Small parts up to 100mm wafers
Location
1439
Dry Etching
Oxford Plasmalab 100 RIE/ICP
Oxford Plasmalab 80 RIE
Trion RIE/ICP Dry Etcher
Technics PEIIB Planar Etcher
Tepla 100
