The New Wave Research QuikLaze-50 ST2 uses laser ablation to remove a variety of materials commonly found in integrated circuits. The laser has three wavelengths: 1064, 532 and 355nm with 2x, 10x, 20x and 100x objectives. Can be used to trim and correct circuit board components. The X-Y aperture allows a minimum cut size of ~1X1um using the 100X objective.