EVG620NT Semi-automated Double Side Mask Alignment System (up to 150mm, double side, manual handling)

• Exposure modes: hard-, soft- and vacuum contact, proximity
• Separation distance 0-300 um adjustable via software
• Wafer size up to 100 mm, pieces down to 20mmx20mm.
• Wafer thickness 0.1 - 10 mm (for top side configuration only)
• Mask size 7inchx7inch, 5inchx5inch or 4inchx4inch.
• Semi automatic loading with mechanical prealignment on chuck
• Quick change of mask and chuck
• Tooling for soft UV-Nanoimprinting & Micro Contact Printing